Guest lecture: Framework for Heterogeneous Systems Integration

Postdoc Boris Vaisband, University of California, Los Angeles.

2018.11.01 | Jens Kargaard Madsen

Date Mon 05 Nov
Time 14:15 15:00
Location Room 424, building 5125, Finlandsgade 22, 8200 Aarhus N

Integration of heterogeneous technologies and functionalities (i.e., materials, devices, and circuits) within a single platform is imperative to support modern performance requirements. Various platforms have been developed for heterogeneous integration, including interposers, 3-D integrated circuits, wafer-scale integration, flexible and bio-compatible technologies, and others. Enablement of these platforms however, requires solutions on a broad span of hierarchy, from technological innovation in materials and devices, through efficient circuit design, up to novel system-level architectures and methodologies. Research across the aforementioned hierarchy will be presented in this talk for two heterogeneous integration platforms: 3-D integrated circuits and silicon interconnect fabric. Suitable applications for each of these platforms will also be discussed. Some of the obtained results exhibit significant performance improvement over classical approaches in terms of area and power; other presented work outlines a path for enablement of a paradigm shift in heterogeneous integration.

Boris Vaisband is currently a postdoctoral scholar at the University of California, Los Angeles, working on wafer-level heterogeneous system integration. He received a B.Sc. degree in Computer Engineering from the Technion – Israel Institute of Technology, Haifa, Israel in 2011, and an M.S. and Ph.D. degrees in Electrical Engineering from the University of Rochester, Rochester, NY, in, respectively 2012 and 2017. Between 2008 and 2011, he held a hardware design position at Intel Corporation in Israel. In the summer of 2013, he interned with the Optical and RF research group at Cisco Systems Inc., San Jose, CA. In the summer of 2015, he interned with the Power Design team at Google Inc., Mountain View, CA. His current research interests include integration of heterogeneous systems, power delivery, communication, thermal aware design and floorplanning, and noise coupling for high performance computing, IoT, and bio-compatible systems.

Lecture / talk